Intel Corporation has just unveiled plans on how the company is providing a foundation on which to build common hardware, software and ecosystem solutions to make computing experiences and devices work together seamlessly and with ease of use.
True to Intel’s vision recently, it has released it new brand of award-winning microarchitecture chip design, codenamed "Nehalem," with the recent launch of the Intel Xeon processor 7500 series. In less than 90 days, Intel has introduced all-new 2010 PC, laptop and server processors that increase energy efficiency and computing speed, and include a multitude of new features that make computers more intelligent, flexible and reliable.
"With an additional 1 billion connected computing users by 2015 and with more types of devices there is value in providing a common experience between the devices. Intel architecture delivers the right combination of performance and power that provides the foundation across all computing devices creating a virtual continuum of computing to enable this common user experience."said Perlmutter, executive vice president and co-general manager, Intel Architecture Group (IAG),
Updates on next generation Intel® Core™ processors using the Intel microarchitecture codenamed "Sandy Bridge," were discussed which are targeted to be in production in late 2010. These processors will be the first to support Intel® Advanced Vector Extension (Intel® AVX) instructions. The introduction of AVX will accelerate the trends toward floating point intensive computation in general purpose applications like image, video, and audio processing, as well as engineering applications, including 3D modeling and analysis, scientific simulation, and financial analytics.
Intel's forthcoming "Moorestown" platform, is scheduled for introduction during the first half of this year in which Intel has repartitioned its platform architecture and implemented a number of innovative techniques, such as next generation OS power management and distributed power gating, for achievement of improved performance and major reductions in idle and active power envelopes.
Currently, Intel is working with PC manufacturers Tongfang and Hanvon to introduce the new convertible classmate PC design that combines aesthetics with ruggedness, full PC functionality with enhanced e-reading capabilities and improved performance with energy efficiency. The flexible design of the new convertible classmate PC works and moves the way students do and its development was based on extensive ethnographic research with students and teachers.